PolyDissolve™ is a family of dissolvable support filaments. This family offers support solution for Polymakers portfolio of filaments. It enables a greater design freedom.
PolyDissolve™ S2 enables printing of complex geometries, overhangs, internal cavities and complicated structures with improved surface quality where supports interface. It also liberates you from support removal problems, and enables greater design freedom.
- Nozzle Temperature: 230˚C – 250˚C
- Printing Speed: 30mm/s – 40mm/s
- Bed Temperature: 90˚C – 110˚C
- Bed Surface: Work on most surfaces designed for high temperature materials.
- Cooling Fan: OFF
Note: It is highly recommended to use the PolyBox™ when printing with PolyDissolve™ S2 and to store it in the resealable bag.